MediaTek Dimensity 9400+ launched: With the official release of its newest flagship mobile CPU, the Dimensity 9400+, MediaTek has made a major advancement in on-device AI capabilities and connection.?
This updated chipset, which builds on the Dimensity 9400, offers improved performance and efficiency because of TSMC's second-generation 3nm N3E technology.?
Interestingly, it allows for the local execution of DeepSeek-R1 AI models, allowing for sophisticated AI features right on the device. The chipset also sets a new benchmark for wireless communication with its remarkable 15-kilometre Bluetooth range.?
The next generation of smartphones will be powered by the Dimensity 9400+ thanks to these developments, providing users with a smooth and intelligent mobile experience.?
Continue reading our in-depth post for a thorough analysis of its characteristics and what this means for future gadgets.?
Using the same all-big core design, the Dimensity 9400+ has four Cortex-A720 cores, three Cortex-X4 cores, and one Cortex-X925 core.?
Its foundation is up to 40% more power-efficient 2nd-generation N3E 3nm architecture from TSMC. This chipset has a maximum clock speed of 3.73GHz, which is 100MHz faster than the Dimensity 9400.
The same 12-core Immortalis-G925 GPU, which supports upscaling and ray tracing, is used in the new chip. It has a MediaTek NPU 890, one of the first chips to support on-device DeepSeek-R1 models.?
Additionally, it has multi-modal capabilities for running SLM and LLM AI models. This enables the CPU to handle several AI processes at once, producing quicker and more accurate outcomes.?
MediaTek has significantly improved connectivity. Advanced phone-to-phone Bluetooth connections are supported by the new chip, giving compatible devices an effective Bluetooth range of up to 15 kilometres. Additionally, 5G download speeds of up to 7 Gbps are supported.
With the help of MediaTek UltraSave 4.0 technology, the Dimensity 9400+ may cut 5G power usage by up to 18%. In comparison to the Dimensity 9400, this CPU can provide better standby battery efficiency and power consumption when paired with the new TSMC architecture.
According to MediaTek, smartphones featuring the new Dimensity 9400+ processor will go on sale in the second quarter of 2025.?
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