Intel¡¯s Lakefield Processors Ready To Fight Off ARM And Snapdragon CPUs In Laptops
Intel has unveiled two CPUs in the lineup -- Intel Core i5-L16G7 (clocked at 1.4GHz) and Core i3-L13G4 (clocked at 0.8GHz base frequency).
While Intel has been a leader in making computer CPUs, it hasn¡¯t been as successful in power-efficient CPUs for devices like tablets like ARM, Snapdragon are capable of doing.
Intel
However, not for long, as Intel has just announced its first hybrid CPUs dubbed Lakefield CPU designs that fuse high-power and low-power architectures.
Intel has unveiled two CPUs in the lineup -- Intel Core i5-L16G7 (clocked at 1.4GHz) and Core i3-L13G4 (clocked at 0.8GHz base frequency). These CPUs feature one high power core and four high-efficiency cores -- basically making most of Core and Atom technologies to strike the perfect balance.
A new three-layered architecture
The Intel Lakefield processors have five core and five thread setup with one high performing Sunny Cove core (first announced in 2018) along with four lower-power Tremont cores (found in low-powered Celeron and Atom processors). These are paired with Intel¡¯s UHD Graphics, I/O as well as DRAM using its novel 3D Foveros stacking technology, which according to Intel, allows for the CPU to be 56 percent smaller than its current line-up.
Primarily designed for folding form-factor machines, this will basically allow motherboard designers to reduce their size even further and help in making lighter devices that don¡¯t compromise on performance and efficiency.
The CPUs are also not very power-hungry with a 7W TDP and consuming only 2.5mW of power, when on standby -- a whopping 91 percent less than its 8th generation Y series processors that are designed for mobile machines.
Intel
Chris Walker, Intel corporate vice president and general manager of Mobile Client Platforms said in a statement, ¡°Intel Core processors with Intel Hybrid Technology are the touchstone of Intel¡¯s vision for advancing the PC industry by taking an experience-based approach to designing silicon with a unique combination of architectures and IPs.¡±
He added, ¡°Combined with Intel¡¯s deepened co-engineering with our partners, these processors unlock the potential for innovative device categories of the future.¡±
The first series of machines to be fitted with this setup will be Samsung¡¯s Galaxy Book S and Lenovo¡¯s ThinkPad X1 Fold, with other machines to soon join the bandwagon.
